“Heterogeneous integration of group iii nitride on silicon for advanced integrated circuits,” U.S. Patent 9,053,930, issued June 9, 2015
Category: Patent
US patent issued
“Group III nitrides on nanopatterned substrates,” U.S. Patent 8,927,398, issued January 6, 2015
US patent issued
“Thin film wafer transfer and structure for electronic devices,” U.S. Patent 8,916,451, issued December 23, 2014