Alkesh joins MIT Lincoln Laboratory

Alkesh joins MIT Lincoln Laboratory as an Integrated Photonics Development Engineer. He will be working with the Quantum Info & Integrated Nanosystems Group, and be part of the Photonics Nanofabrication team. His team is based at Lexington, MA.

Yi-Chia joins ASML Corporation

Yi-Chia defended his doctoral thesis on April 4th, 10:00 am.

Yi-Chia will be responsible for designing and developing algorithms to improve performance and accuracy of the world-leading lithography models for microchip manufacturing. His team is based at San Jose, CA.

Congrats to Dr. Yi-Chia Tsai and thanks to all our sponsors for supporting his research.

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Ali joins Structured Materials Industries

Ali will be responsible of designing and developing AlGaN/GaN transistors for power electronics applications to improve performance and accuracy of next generation RF/power devices. His team is based at Piscataway, NJ.

Congrats to Dr. Ali Johar and thanks to all our sponsors for supporting his research.

Dicky joins Aerospace Corporation

Dicky defended his doctoral thesis on March 30th, 11:00 am.

Dicky will be responsible of exploring reliability of GaN electronics and III-V infrared sensors (as an alternative to MCT) for space applications. His team is based at the Los Angeles site.

Congrats to Dr. Richard (Dicky) Liu and thanks to all our sponsors for supporting his research.

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Journal paper highlighted as the Front Cover

ACS Omega selected our work (ACS Omega 5, 3917 – 3923 (2020) as the issue Front Cover.

The cover art illustrates the crystal structure and band alignments of zincblende AlN/GaN/InN heterostructures. The innovative zincblende III-nitrides material system featuring type-I band alignment and polarization-free nature is beneficial to capture both electrons and holes for recombination and has broad emission wavelength ranging from ultraviolet, blue, green, to red spectrum.

Front Cover

Kihoon joins Intel

Kihoon defended his doctoral thesis on Jan. 17th, 9:30 am in HMNTL 3005.

Kihoon joins Intel as a TCAD SW / Modeling Engineer. He will be responsible of building new models involving device physics, implementing them in TCAD, benchmarking results against experimental results, and using them to support other groups. The job will also give him opportunity to do research in futuristic devices. His team is based at the Hillsboro site and is part of the LTD (Logic Technology Development) group.

Congrats to Dr. Kihoon Park and thanks to all our sponsors for supporting his research.

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