Alkesh joins MIT Lincoln Laboratory as an Integrated Photonics Development Engineer. He will be working with the Quantum Info & Integrated Nanosystems Group, and be part of the Photonics Nanofabrication team. His team is based at Lexington, MA.
“Portable device charging applications, high wall plug efficiency innovations, and directed energy applications“, by Joseph Park, ECE ILLINOIS, 5/24/2022.
Yi-Chia defended his doctoral thesis on April 4th, 10:00 am.
Yi-Chia will be responsible for designing and developing algorithms to improve performance and accuracy of the world-leading lithography models for microchip manufacturing. His team is based at San Jose, CA.
Congrats to Dr. Yi-Chia Tsai and thanks to all our sponsors for supporting his research.
Dicky defended his doctoral thesis on March 30th, 11:00 am.
Dicky will be responsible of exploring reliability of GaN electronics and III-V infrared sensors (as an alternative to MCT) for space applications. His team is based at the Los Angeles site.
Congrats to Dr. Richard (Dicky) Liu and thanks to all our sponsors for supporting his research.
“ECE 443 Course Project Highlights: Improved Solar Cells for Low Earth Orbit Constellation Satellites and the Fight Against COVID-19“‘, by Joseph Park, ECE ILLINOIS, 5/20/2020.
“Illinois ECE graduate student develops sustainable disinfection system for N-95 masks in Haiti“, by Joseph Park, ECE ILLINOIS, 5/20/2020.
Kihoon defended his doctoral thesis on Jan. 17th, 9:30 am in HMNTL 3005.
Kihoon joins Intel as a TCAD SW / Modeling Engineer. He will be responsible of building new models involving device physics, implementing them in TCAD, benchmarking results against experimental results, and using them to support other groups. The job will also give him opportunity to do research in futuristic devices. His team is based at the Hillsboro site and is part of the LTD (Logic Technology Development) group.
Congrats to Dr. Kihoon Park and thanks to all our sponsors for supporting his research.
Hsuan-Ping defended his doctoral thesis successfully on Jan. 16th, 2 pm in HMNTL 3003.
Hsuan-Ping joins Intel as a Transistor/Interconnect Process/Device Development Engineer. He will mainly be responsible for leading scientific research to enable design, definition of transistor/interconnect architecture and high volume manufacturing of products with innovative microprocessors. His team is based at the Hillsboro site.
Congrats to Dr. Hsuan-Ping Lee and thanks to all our sponsors for supporting his research.
“ECE award winners propose solutions in green LEDs, LED color quality, and solar cells for space exploration“, by Ryann Monahan, ECE ILLINOIS, 6/6/2019